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AP02N60I
N-CHANNEL ENHANCEMENT MODE POWER MOSFET
Advanced Power Electronics Corp.
Repetitive Avalanche Rated Fast Switching Simple Drive Requirement
G S D
BVDSS RDS(ON) ID
600V 8 2A
Description
The TO-220CFM package is universally preferred for all commercialindustrial applications. The device is suited for switch mode power supplies ,AC-DC converters and high current high speed switching circuits.
G
D
S
TO-220CFM(I)
Absolute Maximum Ratings
Symbol VDS VGS ID@TC=25 ID@TC=100 IDM PD@TC=25 EAS IAR EAR TSTG TJ Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current
1
Rating 600 30 2 1.26 3.6 22 0.176
2
Units V V A A A W W/ mJ A mJ
Total Power Dissipation Linear Derating Factor Single Pulse Avalanche Energy Avalanche Current Repetitive Avalanche Energy Storage Temperature Range Operating Junction Temperature Range
80 2 2 -55 to 150 -55 to 150
Thermal Data
Symbol Rthj-c Rthj-a Parameter Thermal Resistance Junction-case Thermal Resistance Junction-ambient Max. Max. Value 5.7 62 Unit /W /W
Data & specifications subject to change without notice
200117032
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Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol BVDSS
BVDSS/Tj
Parameter Drain-Source Breakdown Voltage
Test Conditions VGS=0V, ID=1mA
Min. 600 2 -
Typ. 0.6 0.2 14 2 8.5 9.5 12 21 9 155 27 14
Max. Units 8 4 10 100 100 V V/ V S uA uA nA nC nC nC ns ns ns ns pF pF pF
Breakdown Voltage Temperature Coefficient Reference to 25, ID=1mA
RDS(ON) VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss
Static Drain-Source On-Resistance Gate Threshold Voltage Forward Transconductance
Drain-Source Leakage Current (Tj=25 C) Drain-Source Leakage Current (Tj=150 C)
o o
VGS=10V, ID=1A VDS=VGS, ID=250uA VDS=20V, ID=1A VDS=600V, VGS=0V VDS=480V, VGS=0V VGS= 30V ID=2A VDS=480V VGS=10V VDS=300V ID=2A RG=10,VGS=10V RD=150 VGS=0V VDS=25V f=1.0MHz
Gate-Source Leakage Total Gate Charge
3
Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance
3
Source-Drain Diode
Symbol IS ISM VSD Parameter
Continuous Source Current ( Body Diode )
Test Conditions VD=VG=0V , VS=1.5V
1
Min. -
Typ. -
Max. Units 2 3.6 1.5 A A V
Pulsed Source Current ( Body Diode )
Forward On Voltage
3
Tj=25, IS=2A, VGS=0V
Notes: 1.Pulse width limited by safe operating area. 2.Starting Tj=25oC , VDD=50V , L=40mH , RG=25 , IAS=2A. 3.Pulse width <300us , duty cycle <2%.
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AP02N60I
1.5
T C =25 o C
10V 6.0V 5.5V
0.8
T C =150 o C
10V 6.0V 5.5V
ID , Drain Current (A)
ID , Drain Current (A)
1
0.6
5.0V
0.4
5.0V
0.5
V GS =4.5V
0.2
V GS =4.5V
0 0 5 10 15 20
0 0 5 10 15 20
V DS , Drain-to-Source Voltage (V)
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
1.2
2.8
2.4
I D =1A V GS =10V
1.1 2
Normalized BVDSS (V)
Normalized R DS(ON)
1.6
1
1.2
0.8 0.9
0.4
0.8 -50 0 50 100 150
0 -50 0 50 100 150
T j , Junction Temperature ( o C)
T j , Junction Temperature ( C )
o
Fig 3. Normalized BVDSS v.s. Junction Temperature
Fig 4. Normalized On-Resistance v.s. Junction Temperature
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AP02N60I
2.4
30
2
ID , Drain Current (A)
1.6
20
1.2
PD (W)
10 0
25 50 75 100 125 150
0.8
0.4
0
0
50
100
150
T c , Case Temperature ( C )
o
Tc, Case Temperature ( C )
o
Fig 5. Maximum Drain Current v.s.
Fig 6. Typical Power Dissipation
Case Temperature
10
1
Duty Factor = 0.5
Normalized Thermal Response (R thjc)
100us
1
0.2
1ms ID (A) 10ms
0.1
0.1
0.1
0.05
100ms
0.02
PDM
t
0.01 Single Pulse
T
Duty Factor = t/T Peak Tj = P DM x Rthjc + TC
T C =25 o C Single Pulse
0.01 1 10 100 1000 10000
0.01 0.00001 0.0001 0.001 0.01 0.1 1 10
V DS (V) t , Pulse Width (s)
Fig 7. Maximum Safe Operating Area
Fig 8. Effective Transient Thermal Impedance
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AP02N60I
f=1.0MHz
16 1000
I D =2A
14
V DS =320V V DS =400V V DS =480V
VGS , Gate to Source Voltage (V)
12
10
Ciss C (pF)
100
8
6
4
Coss
2
Crss
0 0 2 4 6 8 10 12 14 16 18 20 10 1 5 9 13 17 21 25 29
V DS (V) Q G , Total Gate Charge (nC)
Fig 9. Gate Charge Characteristics
Fig 10. Typical Capacitance Characteristics
100
5
4
10
VGS(th) (V)
1.4 1.6
T j = 150 o C IS (A)
T j = 25 o C
3
2
1
1
0.1 0 0.2 0.4 0.6 0.8 1 1.2
0 -50 0 50 100 150
V SD (V)
T j , Junction Temperature ( o C )
Fig 11. Forward Characteristic of
Reverse Diode
Fig 12. Gate Threshold Voltage v.s. Junction Temperature
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AP02N60I
VDS
RD
90%
D
VDS
TO THE OSCILLOSCOPE 0.5x RATED VDS
RG
G
10%
+ 10 V S VGS
VGS td(on) tr td(off) tf
Fig 13. Switching Time Circuit
Fig 14. Switching Time Waveform
VG
VDS TO THE OSCILLOSCOPE
QG 10V
D
G S
+
0.8 x RATED VDS
QGS
QGD
VGS
1~ 3 mA
IG ID
Charge
Q
Fig 15. Gate Charge Circuit
Fig 16. Gate Charge Waveform


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